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this is information on a product in full production. june 2013 docid5150 rev 11 1/24 ts922, ts922a rail-to-rail, high output curre nt dual operational amplifier datasheet - production data features ? rail-to-rail in put and output ? low noise: 9 nv/ hz ? low distortion ? high output current: 80 ma (able to drive 32 loads) ? high-speed: 4 mhz, 1 v/ s ? operating from 2.7 to 12 v ? low input offset voltage: 900 v max. (ts922a) ? esd internal protection: 2 kv ? latch-up immunity ? macromodel included in this specification ? dual version available in flip-chip package applications ? headphone and servo amplifiers ? sound cards, multimedia systems ? line drivers, actuator drivers ? mobile phones and portable equipment ? instrumentation with low noise as key factor ? piezoelectric speaker drivers description ts922 and ts922a devices are rail-to-rail dual bicmos operational amplifiers optimized and fully specified for 3 v and 5 v operation. these devices have high output currents which allow low-load impedances to be driven. very low noise, low dist ortion, low offset, and a high output current capability make these devices an excellent choice for high quality, low voltage, or battery operated audio systems. the devices are stable for capacitive loads up to 500 pf. d so8 (plastic micropackage) p tssop8 (thin shrink small outline package) j flip-chip with backcoating n dip8 (plastic package) miniso8 (plastic micropackage) www.st.com
contents ts922, ts922a 2/24 docid5150 rev 11 contents 1 pin diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 absolute maximum ratings and operating c onditions . . . . . . . . . . . . . 4 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 4 ts922, ts922a macromodel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 important note concerning this macromodel . . . . . . . . . . . . . . . . . . . . . . 12 4.2 electrical characteristics from macromodelization . . . . . . . . . . . . . . . . . . 12 4.3 macromodel code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 5 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 5.1 8-bump flip-chip package information . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.2 miniso8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.3 so8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.4 tssop8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.5 dip8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
docid5150 rev 11 3/24 ts922, ts922a pin diagrams 24 1 pin diagrams figure 1. pinout for flip-chip package (top view) figure 2. pin connections for mi niso8, so8, tssop8, and dip8 (top view) out2 -in2 +in2 vcc+ gnd +in1 -in1 out1 - - + + out2 -in2 +in2 v cc + v cc - +in1 -in1 out1 - - + +
absolute maximum ratings and op erating conditions ts922, ts922a 4/24 docid5150 rev 11 2 absolute maximum ratings and operating conditions table 1. absolute maximum ratings (amr) symbol parameter value unit v cc supply voltage (1) 1. all voltage values, except differential volt age are with respect to network ground terminal. 14 v v id differential input voltage (2) 2. the differential voltage is the non-inverting input termi nal with respect to the inverting input terminal. if v id > 1 v, the maximum input current must not exceed 1 ma. in this case (v id > 1 v), an input series resistor must be added to limit the input current. 1 v in input voltage (3) 3. do not exceed 14 v. v cc- -0.3 to v cc+ +0.3 t stg storage temperature -65 to +150 c r thja thermal resistance junction to ambient (4) flip-chip so8 tssop8 4. short-circuits can cause excessi ve heating. destructive dissipation can result from simultaneous short- circuits on all amplifiers. these values are typical. 90 125 120 c/w r thjc thermal resistance junction to case (4) so8 tssop8 40 37 t j maximum junction temperature 150 c esd hbm: human body model (5) mm: machine model (6) cdm: charged device model (7) 5. human body model: 100 pf discharged through a 1.5 k resistor between two pins of the device, done for all couples of pin combinati ons with other pins floating. 6. machine model: a 200 pf capacitor is charged to the specified voltage, then discharged directly between two pins of the device with no external series resistor (internal resistor < 5 ). this is done for all couples of pin combinations with other pins floating. 7. charged device model: all pins and plus package ar e charged together to the specified voltage and then discharged directly to ground. 2000 120 1500 v output short-circuit duration see note (8) 8. there is no short-circuit prot ection inside the device: short- circuits from the output to v cc can cause excessive heating. the maximum output current is approximately 80 ma, independent of the magnitude of v cc . destructive dissipation can result from si multaneous short-circuits on all amplifiers. latch-up immunity 200 ma soldering temperature (10 s), leaded version soldering temperature (10 s), unleaded version 250 260 c
docid5150 rev 11 5/24 ts922, ts922a absolute maximum ratings and operating conditions 24 table 2. operating conditions symbol parameter value unit v cc supply voltage 2.7 to 12 v v icm common mode input voltage range v cc- -0.2 to v cc+ +0.2 t oper operating free air temperature range -40 to +125 c
electrical characteristics ts922, ts922a 6/24 docid5150 rev 11 3 electrical characteristics table 3. electrical characteristics measured at v cc = +3 v, v cc - = 0 v, v icm = v cc /2, t amb = 25 c, and r l connected to v cc /2 (unless otherwise specified) symbol parameter test conditions min. typ. max. unit v io input offset voltage ts922 ts922a ts922ij (flip-chip) 3 0.9 1.5 mv t min t amb t max ts922 ts922a ts922ij (flip-chip) 5 1.8 2.5 v io / t input offset voltage drift 2 v/c i io input offset current v out = v cc /2 t min t amb t max 130 30 na i ib input bias current v out = v cc /2 t min t amb t max 15 100 100 v oh high level output voltage r l = 10 k t min t amb t max 2.90 2.90 v r l = 600 t min t amb t max 2.87 2.87 r l = 32 2.63 v ol low level output voltage r l = 10 k t min t amb t max 50 50 mv r l = 600 t min t amb t max 100 100 r l = 32 180 a vd large signal voltage gain r l = 10 k , v out = 2 v p-p t min t amb t max 70 200 v/mv r l = 600 , v out = 2 v p-p t min t amb t max 15 35 r l = 32 , v out = 2 v p-p 16 i cc total supply current no load, v out = v cc /2 t min t amb t max 23 3.2 ma gbp gain bandwidth product r l = 600 4mhz cmr common mode rejection ratio v icm = 0 to 3 v t min t amb t max 60 56 80 db svr supply voltage rejection ratio v cc = 2.7 to 3.3 v t min t amb t max 60 60 85 i o output short-circuit current 50 80 ma sr slew rate 0.7 1.3 v/ s
docid5150 rev 11 7/24 ts922, ts922a electrical characteristics 24 m phase margin at unit gain r l = 600 , c l = 100 pf 68 degrees g m gain margin 12 db e n equivalent input noise voltage f = 1 khz 9 thd total harmonic distortion v out = 2 v p-p , f = 1 khz, a v = 1, r l = 600 0.005 % c s channel separation 120 db table 3. electrical characteristics measured at v cc = +3 v, v cc - = 0 v, v icm = v cc /2, t amb = 25 c, and r l connected to v cc /2 (unless otherwise specified) (continued) symbol parameter test conditions min. typ. max. unit n v hz ----------- -
electrical characteristics ts922, ts922a 8/24 docid5150 rev 11 table 4. electrical characteristics measured at v cc = 5 v, v cc - = 0 v, v icm = v cc /2, t amb = 25 c, and r l connected to v cc /2 (unless otherwise specified) symbol parameter conditions min. typ. max. unit v io input offset voltage ts922 ts922a ts922ij (flip-chip) 3 0.9 1.5 mv t min t amb t max ts922 ts922a ts922ij (flip-chip) 5 1.8 2.5 v io / t input offset voltage drift 2 v/c i io input offset current v out = v cc /2 t min t amb t max 130 30 na i ib input bias current v out = v cc /2 t min t amb t max 15 100 100 v oh high level output voltage r l = 10 k t min t amb t max 4.9 4.9 v r l = 600 t min t amb t max 4.85 4.85 r l = 32 4.4 v ol low level output voltage r l = 10 k t min t amb t max 50 50 mv r l = 600 t min t amb t max 120 120 r l = 32 300 a vd large signal voltage gain r l = 10 k , v out = 2 v p-p t min t amb t max 70 200 v/mv r l = 600 , v out = 2 v p-p t min t amb t max 20 35 r l = 32 , v out = 2 v p-p 16 i cc total supply current no load, v out = v cc /2 t min t amb t max 23 3.2 ma gbp gain bandwidth product r l = 600 4mhz cmr common mode rejection ratio v icm = 0 to 5 v t min t amb t max 60 56 80 db svr supply voltage rejection ratio v cc = 4.5 to 5.5 v t min t amb t max 60 60 85 i o output short-circuit current 50 80 ma sr slew rate 0.7 1.3 v/ s m phase margin at unit gain r l = 600 , c l =100 pf 68 degrees g m gain margin 12 db e n equivalent input noise voltage f = 1 khz 9 n v hz ----------- -
docid5150 rev 11 9/24 ts922, ts922a electrical characteristics 24 thd total harmonic distortion v out = 2 v p-p , f = 1 khz, a v = 1, r l = 600 0.005 % c s channel separation 120 db table 4. electrical characteristics measured at v cc = 5 v, v cc - = 0 v, v icm = v cc /2, t amb = 25 c, and r l connected to v cc /2 (unless otherwise specified) (continued) symbol parameter conditions min. typ. max. unit
electrical characteristics ts922, ts922a 10/24 docid5150 rev 11 figure 3. output short-circuit current vs. output voltage figure 4. total supply current vs. supply voltage figure 5. voltage gain and phase vs. frequency figure 6. equivalent input noise voltage vs. frequency 1e+02 1e+03 1e+04 1e+05 1e+06 1e+07 1e+08 -20 0 20 40 60 -60 0 60 120 180 frequency (hz) gain (db) ph ase (deg .) gain phase c l = 100 pf 0.01 0.1 1 10 100 frequency (khz) 0 5 10 15 20 25 30 equivalent i nput noise (nv/sqrt(hz) v cc = 1.5 v r l = 100 , v o = 10 vpp , v cc = 6 v) figure 8. thd + noise vs. frequency (r l = 32 , v o = 4 vpp , v cc = 2.5 v) 0.01 0.1 1 10 10 0 frequency (khz) 0 0.005 0.01 0.015 0.02 thd + noise (%) r l = 2 k , v o = 10 vpp v cc = 6 v, av = 1 0.01 0.1 1 10 10 0 frequency (khz) 0 0.008 0.016 0.024 0.032 0.04 thd + noise (%) r l = 32 , v o = 4 vpp v cc = 2.5 v, av = 1
docid5150 rev 11 11/24 ts922, ts922a electrical characteristics 24 figure 9. thd + noise vs. frequency (r l = 32 , v o = 2 vpp , v cc = 1.5 v) figure 10. thd + noise vs. output voltage (r l = 600 , f = 1 khz, v cc = 0/3 v) 0.01 0.1 1 10 100 frequency (khz) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 thd + noise (%) r l = 32 , v o = 2 vpp v cc = 1.5 v, av = 10 0 0,2 0,4 0,6 0,8 1 1,2 0,001 0,010 0,100 1,000 10,000 v out (vrms) thd + noise (%) r l = 600 , f = 1 khz v cc = 0/3 v, av = -1 figure 11. thd + noise vs. output voltage (r l = 32 , f = 1 khz, v cc = 1.5 v) figure 12. thd + noise vs. output voltage (r l = 2 k , f = 1 khz, v cc = 1.5 v) figure 13. open loop gain and phase vs. frequency 0 0.2 0.4 0.6 0. v out (vrms) 0.01 0.1 1 10 thd + noise (%) r l = 32 , f = 1 khz v cc = 1.5 v, av = -1 0 0.2 0.4 0.6 0.8 1 1.2 v out (vrms) 0.001 0.01 0.1 1 10 thd + no ise (%) r l = 2 k , f = 1 khz v cc = 1.5 v, av = -1 1e+2 1e+3 1e+4 1e+5 1e+6 1e+7 1e+8 frequency (hz) 0 10 20 30 40 50 gain (db) 0 60 120 180 phase (deg.) c l = 500 pf
ts922, ts922a macromodel ts922, ts922a 12/24 docid5150 rev 11 4 ts922, ts922a macromodel 4.1 important note concer ning this macromodel ? all models are a trade-off between accuracy and complexity (i.e. simulation time). ? macromodels are not a substitute to breadboarding; rather, they confirm the validity of a design approach and help to select surrounding component values. ? a macromodel emulates the nominal performance of a typical device within specified operating conditions (for example, temperature and supply voltage). thus the macromodel is often not as exhaustive as th e datasheet, its purpose is to illustrate the main parameters of the product. data derived from macromodels used outside of the specified conditions (for example, v cc , temperature) or worse, outside of the de vice operating conditions (for example, v cc , v icm ), are not reliable in any way. section 4.2 provides the electrical characteristics resulting from the use of the ts922, ts922a macromodel. 4.2 electrical characteristi cs from macromodelization table 5. electrical char acteristics resulting from macromodel simulation at v cc = 3 v, v cc - = 0 v, r l , c l connected to v cc /2, t amb = 25 c (unless otherwise specified) symbol conditions value unit v io 0mv a vd r l = 10 k 200 v/mv i cc no load, per operator 1.2 ma v icm -0.2 to 3.2 v v oh r l = 10 k 2.95 v ol 25 mv i sink v o = 3 v 80 ma i source v o = 0 v gbp r l = 600 k 4mhz sr r l = 10 k , c l = 100 pf 1.3 v/ s mr l = 600 k 68 degrees
docid5150 rev 11 13/24 ts922, ts922a ts922, ts922a macromodel 24 4.3 macromodel code ** standard linear ics macromodels, 1996. ** connections: * 1 inverting input * 2 non-inverting input * 3 output * 4 positive power supply * 5 negative power supply * .subckt ts92x 1 2 3 4 5 * .model mdth d is=1e-8 kf=2.664234e-16 cjo=10f * * input stage cip 2 5 1.000000e-12 cin 1 5 1.000000e-12 eip 10 5 2 5 1 ein 16 5 1 5 1 rip 10 11 8.125000e+00 rin 15 16 8.125000e+00 ris 11 15 2.238465e+02 dip 11 12 mdth 400e-12 din 15 14 mdth 400e-12 vofp 12 13 dc 153.5u vofn 13 14 dc 0 ipol 13 5 3.200000e-05 cps 11 15 1e-9 dinn 17 13 mdth 400e-12 vin 17 5 -0.100000e+00 dinr 15 18 mdth 400e-12 vip 4 18 0.400000e+00 fcp 4 5 vofp 1.865000e+02 fcn 5 4 vofn 1.865000e+02 fibp 2 5 vofp 6.250000e-03 fibn 5 1 vofn 6.250000e-03 * gm1 stage *************** fgm1p 119 5 vofp 1.1 fgm1n 119 5 vofn 1.1 rap 119 4 2.6e+06 ran 119 5 2.6e+06 * gm2 stage *************** g2p 19 5 119 5 1.92e-02 g2n 19 5 119 4 1.92e-02 r2p 19 4 1e+07
ts922, ts922a macromodel ts922, ts922a 14/24 docid5150 rev 11 r2n 19 5 1e+07 ************************** vint1 500 0 5 gconvp 500 501 119 4 19.38 vp 501 0 0 gconvn 500 502 119 5 19.38 vn 502 0 0 ********* orientation isink isource ******* vint2 503 0 5 fcopy 503 504 vout 1 dcopyp 504 505 mdth 400e-9 vcopyp 505 0 0 dcopyn 506 504 mdth 400e-9 vcopyn 0 506 0 *************************** f2pp 19 5 poly(2) vcopyp vp 0 0 0 0 0.5 f2pn 19 5 poly(2) vcopyp vn 0 0 0 0 0.5 f2np 19 5 poly(2) vcopyn vp 0 0 0 0 1.75 f2nn 19 5 poly(2) vcopyn vn 0 0 0 0 1.75 * compensation ************ cc 19 119 25p * output *********** dopm 19 22 mdth 400e-12 donm 21 19 mdth 400e-12 hopm 22 28 vout 6.250000e+02 vipm 28 4 5.000000e+01 honm 21 27 vout 6.250000e+02 vinm 5 27 5.000000e+01 vout 3 23 0 rout 23 19 6 cout 3 5 1.300000e-10 dop 19 25 mdth 400e-12 vop 4 25 1.052 don 24 19 mdth 400e-12 von 24 5 1.052 .ends;ts92x
docid5150 rev 11 15/24 ts922, ts922a package information 24 5 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark.
package information ts922, ts922a 16/24 docid5150 rev 11 5.1 8-bump flip-chip package information figure 14. 8-bump flip-chip package dimensions (top view) 1. die size: 1600 m x 1600 m 30 m die height: 350 m 20 m die height (including bumps): 650 m bump diameter: 315 m 50 m bump height: 250 m 40 m pitch: 500 m 10 m backcoating figure 15. 8-bump flip-chip footprint recommendation
docid5150 rev 11 17/24 ts922, ts922a package information 24 figure 16. 8-bump flip-chip marking (top view) 1. st logo 2. part number 3. date code: y = year, ww = week 4. this dot indicates the bump corner 1a figure 17. 8-bump flip-chip tape and reel specification (top view) 1. device orientation: the devices are oriented in the carrier pocket with bump number a1 adjacent to the sprocket holes. (1) (2) (3) (4) gams0306131526cb a 1 a 1 user direction of feed a 1 a 1 user direction of feed
package information ts922, ts922a 18/24 docid5150 rev 11 5.2 miniso8 package information figure 18. miniso8 package mechanical drawing table 6. miniso8 package mechanical data symbol dimensions millimeters inches min. typ. max. min. typ. max. a 1.1 0.043 a1 0 0.15 0 0.006 a2 0.75 0.85 0.95 0.030 0.033 0.037 b 0.22 0.40 0.009 0.016 c 0.08 0.23 0.003 0.009 d 2.80 3.00 3.20 0.11 0.118 0.126 e 4.65 4.90 5.15 0.183 0.193 0.203 e1 2.80 3.00 3.10 0.11 0.118 0.122 e 0.65 0.026 l 0.40 0.60 0.80 0.016 0.024 0.031 l1 0.95 0.037 l2 0.25 0.010 k0 80 8 ccc 0.10 0.004
docid5150 rev 11 19/24 ts922, ts922a package information 24 5.3 so8 package information figure 19. so8 package mechanical drawing table 7. so8 package mechanical data symbol dimensions millimeters inches min. typ. max. min. typ. max. a1.750.069 a1 0.10 0.25 0.004 0.010 a2 1.25 0.049 b 0.28 0.48 0.011 0.019 c 0.17 0.23 0.007 0.010 d 4.80 4.90 5.00 0.189 0.193 0.197 e 5.80 6.00 6.20 0.228 0.236 0.244 e1 3.80 3.90 4.00 0.150 0.154 0.157 e 1.27 0.050 h 0.25 0.50 0.010 0.020 l 0.40 1.27 0.016 0.050 l1 1.04 0.040 k 0 8 1 8 ccc 0.10 0.004
package information ts922, ts922a 20/24 docid5150 rev 11 5.4 tssop8 package information figure 20. tssop8 package mechanical drawing table 8. tssop8 package mechanical data symbol dimensions millimeters inches min. typ. max. min. typ. max. a1.200.047 a1 0.05 0.15 0.002 0.006 a2 0.80 1.00 1.05 0.031 0.039 0.041 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.008 d 2.90 3.00 3.10 0.114 0.118 0.122 e 6.20 6.40 6.60 0.244 0.252 0.260 e1 4.30 4.40 4.50 0.169 0.173 0.177 e 0.65 0.0256 k0 80 8 l 0.45 0.60 0.75 0.018 0.024 0.030 l1 1 0.039 aaa 0.10 0.004
docid5150 rev 11 21/24 ts922, ts922a package information 24 5.5 dip8 package information figure 21. dip8 package mechanical drawing table 9. dip8 package mechanical data symbol dimensions millimeters inches min. typ. max. min. typ. max. a5.330.210 a1 0.38 0.015 a2 2.92 3.30 4.95 0.115 0.130 0.195 b 0.36 0.46 0.56 0.014 0.018 0.022 b2 1.14 1.52 1.78 0.045 0.060 0.070 c 0.20 0.25 0.36 0.008 0.010 0.014 d 9.02 9.27 10.16 0.355 0.365 0.400 e 7.62 7.87 8.26 0.300 0.310 0.325 e1 6.10 6.35 7.11 0.240 0.250 0.280 e 2.54 0.100 ea 7.62 0.300 eb 10.92 0.430 l 2.92 3.30 3.81 0.115 0.130 0.150
ordering information ts922, ts922a 22/24 docid5150 rev 11 6 ordering information table 10. order codes order codes temperature range package packaging marking ts922id ts922idt -40 c to +125 c so-8 tube or tape and reel 922i ts922aid ts922aidt 922ai ts922iydt (1) 1. qualified and characterized according to aec q100 and q003 or equivalent, advanced screening according to aec q001 and q 002 or equivalent. so-8 (automotive grade) 922iy ts922aiydt (1) tape and reel 922aiy ts922ipt tssop8 922i ts922aipt 922ai ts922ist miniso8 k158 ts922aist k159 ts922in dip8 tube ts922in ts922iypt (2) 2. qualification and characterization according to aec q100 and q003 or equi valent, advanced screening according to aec q001 and q 002 or equivalent are ongoing. tssop8 (automotive grade) tape and reel 922iy ts922aiypt (2) 922ay ts922iyst (2) miniso8 (automotive grade) k10a TS922AIYST (2) k10b ts922ijt/eijt flip-chip with backcoating 922
docid5150 rev 11 23/24 ts922, ts922a revision history 24 7 revision history table 11. document revision history date revision changes 01-feb-2001 1 first release. 01-jul-2004 2 flip-chip package inserted in the document. 02-may-2005 3 modifications in amr table 1 on page 4 (explanation of v id and v i limits, esd mm and cdm values added, r thja added). 01-aug-2005 4 ppap references inserted in the datasheet, see table 6 on page 22 . 01-mar-2006 5 ts922eijt part number inserted in the datasheet, see table 6 on page 22 . 26-jan-2007 6 modifications in amr table 1 on page 4 (r thjc added), parameter limits on full temperature range added in table 3 on page 6 and table 4 on page 8 . 12-nov-2007 7 added notes on esd in amr table. re-formatted package information. added notes for automotive grade in order codes table. 02-feb-2010 8 document reformatted. added root part number ts922a on cover page. removed ts922aiyd order code from table 10 . 15-jan-2013 9 added miniso8 package. modified test conditions for cmr in table 3 and table 4 . replaced v dd by v cc- in title of ta ble 3 , ta ble 4 , and table 5 . updated titles of figure 7 to figure 12 (added conditions to differentiate them). removed ts922iyd device from table 10 . minor corrections throughout document. 04-jun-2013 10 features : updated package information for flip-chip figure 2 : updated title table 1 : updated footnotes 5 , 6 , and 7 table 3 and table 4 : replaced dv io with v io / t figure 14 : added backcoating to package information figure 16 : updated footnote 3 table 10 : updated package information for flip-chip 27-jun-2013 11 figure 14 : updated to include new height for backcoating
ts922, ts922a 24/24 docid5150 rev 11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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